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In the light of the property relativist theory, the purpose of this paper is to review the impact of radical amendments to strata legislation in Singapore in 1999 which, together with changes to the planning framework, stimulated private‐sector led redevelopment in Singapore. This was achieved through the introduction of majority rule (rather than unanimity) in collective sales (CS) of strata developments. The paper also addresses the issue of how a balance can be achieved between the property rights of majority and minority strata owners.

The paper uses case‐studies, planning provisions, and data on property transactions to analyse the effectiveness of the measures taken to address Singapore's land‐scarcity problem. Legal terms and their significance are addressed in a manner that will also be comprehensible to a non‐legally trained readership.

The cases demonstrate attempts by the authorities to clarify, and to provide a better balance to, the position of those whose property rights had been sacrificed at the altar of redevelopment and urban rejuvenation in Singapore. Nevertheless, there still remain numerous pockets of resistance to CS. These still need to be addressed to reassure the minority in the context of the property relativist theory.

The continued groundswell of protests against collective sale means that there are further issues that need to be addressed to mitigate the plight of the minority. The response of parliament has been reactive, but it remains to be seen whether the minority's concerns have been adequately addressed.

The analysis of the cases, whose decisions turned on the authorities' interpretation of the controversial legislation, is instructive. These can provide valuable pointers for policy makers in other jurisdictions contemplating urban rejuvenation. The twin issues that are dealt with relate to how private‐sector redevelopment can be incentivised through planning measures, without riding roughshod over individuals' private property rights.

This paper aims to study the Gramian solutions and solitonic interactions of a (2 + 1)-dimensional Broer–Kaup–Kupershmidt (BKK) system, which models the nonlinear and dispersive long gravity waves traveling along two horizontal directions in the shallow water of uniform depth.

Pfaffian technique is used to construct the Gramian solutions of the (2 + 1)-dimensional BKK system. Asymptotic analysis is applied on the two-soliton solutions to study the interaction properties.

N-soliton solutions in the Gramian with a real function ζ(y) of the (2 + 1)-dimensional BKK system are constructed and proved, where N is a positive integer and y is the scaled space variable. Conditions of elastic and inelastic interactions between the two solitons are revealed asymptotically. For the three and four solitons, elastic, inelastic interactions and soliton resonances are discussed graphically. Effect of the wave numbers, initial phases and ζ(y) on the solitonic interactions is also studied.

Shallow water waves are studied for the applications in environmental engineering and hydraulic engineering. This paper studies the shallow water waves through the Gramian solutions of a (2 + 1)-dimensional BKK system and provides some phenomena that have not been studied.

The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored.

In this study, thermal shock test between −55°C and 125°C was conducted on Sn-37Pb solder bumps in the BGA package to investigate microstructural evolution and growth mechanism of interfacial intermetallic compounds (IMCs) layer. The effects of thermal shock and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed.

With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow; with the increase of the number of thermal shocks, the shear strength of the solder bumps was decreased. But at the time of 2,000 cycles, the shear strength was increased to the initial strength. Minimum shear strength almost took place at 1,500 cycles in all solder bumps. The differences between maximum shear strength and minimum shear strength were 9.11 MPa and 16.83 MPa, 17.07 MPa and 15.59 MPa in φ0.3 mm and φ0.4 mm, φ0.5 mm and φ0.6 mm, respectively, differences were increased with increasing of ball size. With similar reflow profile, the thickness of IMC decreased as the diameter of the ball increased. The thickness of IMC was 2.42 µm and 2.17 µm, 1.63 µm and 1.77 µm with increasing of the ball size, respectively.

Pb-free solder was gradually used to replace traditional Sn-Pb solder and has been widely used in industry. Nevertheless, some products inevitably used a mixture of Sn-Pb and Pb-free solder to make the transition from Sn-Pb to Pb-free solder. Therefore, it was very important to understand the reliability of Sn-Pb solder joint and more further research works were also needed.

This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using thermal shock (TS) tests.

This paper uses 200-µm pitch silicon flip chips with nickel (Ni) pads and stand-off height of approximately 60 µm, assembled on substrates with copper (Cu) pads. After assembly, the samples were subjected to air-to-air thermal shock testing from 55 to 125 per cent. The transfer time was less than 5 s, and the dwell time at each temperature extreme was 15 min. To investigate the microstructure evolution and crack growth, two samples were removed from the thermal shock chamber at 0, 400, 1,200, 2,000, 5,800 and 7,000 cycles.

The results showed that one (Cu, Ni)₆Sn₅/(Ni, Cu)₃Sn₄ dual-layer structure formed at the Ni pad interface of chip side dominates the micro-joints failure. This is because substantial (Ni, Cu)₃Sn₄ grain boundaries provide a preferential pathway for the catastrophic crack growth. Other IMCs microstructure evolutions that cause the prevalent joints failure as previously reported, i.e. thickened interfacial (Cu, Ni)₆Sn₅ and Ni₃P layer, and coarsened IMCs inside the solder matrix, only contributed to the occurrence of fine cracks. Moreover, the typical interfacial IMCs spalling triggered by thermally induced stress did not take place in this study, showing a positive impact in the micro-joint reliability.

As sustained trends toward multi-functionality and miniaturization of microelectronic devices, the joints size is required to be constantly scaled down in advanced packages. This arises a fact that the reliability of small-size joints is more sensitive to the IMCs because of their high volume proportion and greatly complicated microstructure evolutions. This paper evaluated precise correlations between IMCs microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using TS tests. It found that one (Cu, Ni)₆Sn₅/(Ni, Cu)₃Sn₄ dual-layer structure formed at the Ni pad interface dominate the micro-joints failure, whereas other IMCs microstructure evolutions that cause the prevalent joints failure exhibited nearly negligible effects.

In response to the problem of insufficient traction/braking adhesion force caused by the existence of the third-body medium on the rail surface, this study aims to analyze the utilization of wheel-rail adhesion coefficient under different medium conditions and propose relevant measures for reasonable and optimized utilization of adhesion to ensure the traction/braking performance and operation safety of trains.

Based on the PLS-160 wheel-rail adhesion simulation test rig, the study investigates the variation patterns of maximum utilized adhesion characteristics on the rail surface under different conditions of small creepage and large slip. Through statistical analysis of multiple sets of experimental data, the statistical distribution patterns of maximum utilized adhesion on the rail surface are obtained, and a method for analyzing wheel-rail adhesion redundancy based on normal distribution is proposed. The study analyzes the utilization of traction/braking adhesion, as well as adhesion redundancy, for different medium under small creepage and large slip conditions. Based on these findings, relevant measures for the reasonable and optimized utilization of adhesion are derived.

When the third-body medium exists on the rail surface, the train should adopt the low-level service braking to avoid the braking skidding by extending the braking distance. Compared with the current adhesion control strategy of small creepage, adopting appropriate strategies to control the train’s adhesion coefficient near the second peak point of the adhesion coefficient-slip ratio curve in large slip can effectively improve the traction/braking adhesion redundancy and the upper limit of adhesion utilization, thereby ensuring the traction/braking performance and operation safety of the train.

Most existing studies focus on the wheel-rail adhesion coefficient values and variation patterns under different medium conditions, without considering whether the rail surface with different medium can provide sufficient traction/braking utilized adhesion coefficient for the train. Therefore, there is a risk of traction overspeeding/braking skidding. This study analyzes whether the rail surface with different medium can provide sufficient traction/braking utilized adhesion coefficient for the train and whether there is redundancy. Based on these findings, relevant measures for the reasonable and optimized utilization of adhesion are derived to further ensure operation safety of the train.

The purpose of this study is to explore the corrosion behaviors of tube pile steel with the addition of 0.2 per cent Cu and 0.2 per cent Cu-0.2 per cent Cr in half-immersion environment.

The electrochemical corrosion behaviors of tube pile steel with different alloy-elements addition were identified using the polarization curve method and electrochemical impedance spectroscopy technique. Corrosion product and its morphology were analyzed by X-ray diffraction, optical microscope and scanning electron microscopy.

Results indicate that the most serious corrosion occurred in the liquid-air interface zone due to the higher oxygen and water concentration. With the addition of Cu and Cu-Cr, pits were getting smaller and denser, transforming the corrosion type from pitting corrosion to uniform corrosion gradually. Rust layer containing Cu/Cr tended to compact and inhibited the anodic process, while the enrichment of Cu/Cr in rust layer decelerated the dissolution of substrate, thus the expanding of pits was suppressed.

This paper studied the corrosion behaviors of liquid-air interface zone of tube pile steel and verified the transformation of corrosion type with adding Cu, Cu/Cr elements.

Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages.

A 3D geometric model of SMT package is established. The mechanical properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model.

The results revealed that cracks at different locations and propagation directions have different effect on the fatigue life of the SMT solder joint. From the location of the cracks, Crack 1 has the most significant impact on the thermal fatigue life of the solder joint. Under the same thermal cycling conditions, its life has decreased by 46.98%, followed by Crack 2, Crack 4 and Crack 3. On the other hand, under the same random vibration load, Crack 4 has the most significant impact on the solder joint fatigue life, reducing its life by 81.39%, followed by Crack 1, Crack 3 and Crack 2. From the crack propagation direction, with the increase of crack depth, the thermal fatigue life of the SMT solder joint decreases sharply at first and then continues to decline almost linearly. The random vibration fatigue life of the solder joint decreases continuously with the increase of crack depth. From the crack depth of 0.01 mm to 0.05 mm, the random vibration fatigue life decreases by 86.75%. When the crack width increases, the thermal and random vibration fatigue life of the solder joint decreases almost linearly.

This paper investigates the effects of interface cracks on the fatigue life and provides useful information on the reliability of SMT packages.

The purpose of this study is to investigate whether the corporate environmental, social and governance (ESG) performance of enterprise is influenced by the enterprise digital transformation. In addition, this study explains how enterprise digital transformation affects ESG performance.

The sample covers 4,646 nonfinancial companies listed on China’s A-share market from 2009 to 2021. The study adopts the fixed-effects multiple linear regression to perform the data analysis.

The study finds that enterprise digital transformation has a significant inverted U-shaped impact on ESG performance. Moderate digital transformation can improve enterprise ESG performance, whereas excessive digital transformation will bring new organizational conflicts and increase enterprise costs, which is detrimental to ESG performance. This inverted U-shaped effect is more pronounced in industrial cities, manufacturing industries and enterprises with less financing constraints and executives with financial backgrounds. Enterprise digital transformation mainly affects ESG performance by affecting the level of internal information communication and disclosure, the level of internal control and the principal-agent cost.

The government should take multiple measures to encourage enterprises to choose appropriate digital transformation based on their own production behaviors and development strategies, encourage them to innovate and upgrade their organizational management and development models in conjunction with digital transformation and guide them to use digital technology to improve ESG performance.

This study shows that irrational digital transformation cannot effectively improve the ESG performance of enterprises and promote the sustainable development of the country. Enterprises should carry out reasonable digital transformation according to their own development needs and finally improve the green and sustainable development ability of enterprises and promote the sustainable development of society.

This study examines the relationship between enterprise digital transformation and ESG performance. Different from the linear relationship between the two in previous major studies, this study proves the inverse U-shaped relationship between enterprise digital transformation and ESG performance through mathematical theoretical model derivation and empirical test. This study also explores in detail how corporate digital transformation affects ESG performance, as well as discusses heterogeneity at the city, industry and firm levels. It is proposed that enterprises should take into account their own characteristics and carry out reasonable digital transformation according to their development needs.